Demonstration of selective electroless plating for telecommunication components
Project challenges
Additively Manufactured Electronics (AME) can be an enabling technology for lightweight, functional components in many applications including automotive, aerospace and consumer electronics. AME is not only able to reduce weight of current components, but potentially increase component functionality, enabling increased levels of connectivity and data collection.
Business challenge
Process Innovation
Sector
Electrification
Technology or capability
Laser Processing
Project Challenges
Additively Manufactured Electronics (AME) can be an enabling technology for lightweight, functional components in many applications including automotive, aerospace and consumer electronics. AME is not only able to reduce weight of current components, but potentially increase component functionality, enabling increased levels of connectivity and data collection.
Although processes such as Aerosol Jet or Laser Direct Structuring are available for forming 3D circuitry, the technology has limitation on usable substrate material, conductor thickness and conductivity, the materials involved are often limited and proprietary. Currently there are limited substrate material agnostic processes, and the existing ones require further development for commercialisation.
MTC's Solution
In collaboration with Q5D (UK), ITRI (Taiwan) and AWAN (Taiwan) under the PRIME3D project funded through I-UK, the MTC has developed a laser processing strategy and parameter set to selectively remove an ink mask applied on polymer substrate, leaving a surface that can be selectively plated with copper to create electrical tracks.
The MTC conducted a laser parameter window analysis to optimise the ablation/ cleaning process to ensure the required plating surface is free from the coating but at the same time does not damage the polymer base substrate.
The laser exposed surface was electrolessly plated with 6-12μm of copper.
The as plated conductor thickness is suitable for signal and RF electronics applications. Copper thickness could be further increased via subsequent electroplating to handle increased power carrying capacity.
This project has been instrumental in advancing the design and development of our Laser Processing system. Our collaboration with the MTC has been incredibly valuable; their expertise in laser technology has significantly accelerated our progress toward a flexible and large format laser processing platform.
Ben Monteith, Senior Laser Engineer, Q5D
The Outcome
The MTC has successfully demonstrated a laser ablation/cleaning process to create highly precise and controlled mask for electroless plating.
A 5G antenna was manufactured on a 3D surface as a demonstrator of the developed AME process.
The overall process was highly successful in selectively depositing copper on the antennae demonstrator.
When processing a non-conformal surface, special care is required on the laser scanning strategy to ensure effective mask removal, particularly in hard to reach/steep angle surfaces where orthogonal scanning is not possible.
Benefits to the Client
Enabled the MTC and the PRIME3D consortium to demonstrate the laser metallisation process for manufacture of a 5G antenna design used in consumer electronics.
Demonstrated a selective metallisation process using laser ablation/ cleaning that is effective with a non-proprietary material (PC-ABS).
Supported Q5D in the development of a new laser processing head for their large format 5-axis AME platform.
Enabled a UK capability in laser defined, selective metallisation, a market currently occupied by mostly international suppliers.
The collaboration with the MTC has transcended international boundaries and allowed us to work more closely with experts from both UK and Taiwan to develop innovative technologies and solutions. The collaboration was very efficient and effective resulting in promising technological development in the telecommunication industry.
Allen Hsiao, General Manager, Advanced Wireless and Antenna Inc.